Edge Computing

Bringing Datacenter Performance to the Edge

The Challenge 

Edge AI and real-time processing require datacenter-class performance in distributed locations with strict power, thermal, and physical space constraints. Traditional solutions force a choice between performance and efficiency, limiting deployment density, increasing operational costs, and restricting edge application possibilities.

Our Solution 

Compact, power-efficient optical interconnects enable dense edge deployments without complex cooling infrastructure, making distributed computing and AI economically viable at scale. 

Key Benefits: 

  • Dense edge deployments with passive cooling only 
  • 5-10W complete optical subsystem power budget  
  • Multi-site synchronization for federated learning  
  • Standards-compliant integration with edge hardware

Technical Specifications 

  • Form Factor: Compatible with embedded/compact modules   
  • Power Budget: 5-10W complete system  
  • Operating Temperature: -45°C to +85°C 
  • Cooling Requirements: Passive convection sufficient
  • Standards: OCP and ETSI compliant

Validation 

Joint EU project with several telecommunication partners. 

Target Applications 

  • Autonomous vehicle infrastructure
  • Smart city sensor fusion and processing
  • Industrial IoT edge analytics
  • Retail real-time customer analytics
  • 6G Multi-access Edge Computing (MEC)
  • Remote healthcare and telemedicine